Features:

• Air cooled, compact structure and low power consumption

• Fine and precise marking lines

• Stable performance, convenient operation, and low processing cost

• Superior versatility and wide range of metals and non-metallic materials

Applications:

•  Metals and metal oxides

•  Integrated circuits (IC)

• ABS material (electrical appliances shell)

•  Ink (translucent keys, print products)

• Epoxy resin (electronic components, packaging, insulation layer)